On August 24, SK Hynix is introducing advanced packaging technologies, including Intel’s EMIB, for its next-generation HBM solutions and plans to eventually enter the 3D packaging era. At the 2026 Hot Chips conference, SK Hynix’s Vice President of Packaging Engineering, Jaesik Lee, delivered a presentation titled “Advanced Packaging for High Bandwidth Memory,” explaining how the company will leverage advanced packaging technologies to accelerate its HBM product roadmap.

Currently, SK Hynix is exploring methods such as hybrid bonding to break through the limitations of 16-layer stacking. In the future, SK Hynix also plans to address power consumption challenges by increasing the number of TSVs, improving IO speeds of logic process integration, and optimizing power distribution networks. As of the time of publication, SK Hynix’s stock rose by 1.71%.