P Equity Research and SemiAnalysis researcher Nick Doyle and others discussed high bandwidth flash (HBF) in X Space. Nick stated that it is still too early to determine how much the cost premium of HBF relative to HBM can shrink; existing data mostly comes from vendor claims, such as Sandisk stating that the cost per bit is about one-eighth that of HBM. Yields, testing, and other factors will improve with scale, but structural costs such as TSV, stacking, and pSLC mode will permanently exist, and durability is a key unknown; if wear exceeds expectations, costs will rise.

The application scenarios for HBF are narrow, aimed only at AI inference, especially low batch and long context MoE models, and it is not a replacement for HBM. The actual bandwidth target is about 1.6 TB/s, which is at the HBM3E level, suitable for sequential reads to load model weights, more aligned with the capacity needs of a small number of GPUs in local or private enterprises, rather than ultra-large-scale bandwidth scenarios. Thermal reliability has not yet been resolved; flash memory next to GPUs at high temperatures will accelerate degradation, and mitigation measures such as UCIe separation and daily refresh have yet to be validated.

In terms of manufacturing, Sandisk/Kioxia has experience with 3D NAND, and SK Hynix complements HBM-style stacking capabilities, but mass production is still to be confirmed. Overall, storage is shifting towards a specialized layered market, with NAND shortages expected to continue until 2028, and HBF may further impact supply and demand.