According to DIGITIMES, the Taiwanese semiconductor supply chain reveals that advanced packaging technology is diversifying, with Intel’s EMIB becoming a key option. Google TPU has confirmed the adoption of EMIB packaging, and the first TPU using this technology has met yield standards, with technology, cost, and capacity performance all aligning with Google’s original criteria. The likelihood of continuing to use EMIB in future generations of TPU has significantly increased.

Against the backdrop of ongoing tight capacity at TSMC’s CoWoS, as long as EMIB yield and technology remain up to standard, Google will continue to adopt it. MediaTek, as a relevant ASIC partner, has some managers in its U.S. team with Intel backgrounds, facilitating smoother collaboration between the two parties. Although MediaTek still relies heavily on TSMC, its success with Intel on TPU helps solidify Google’s trust, secure more projects, and provide diverse packaging solutions to cloud customers.

Previously, TSMC called for more suppliers to invest in advanced packaging to share the pressure during its earnings call. The supply chain generally believes that its own capacity expansion will not be limitless, making the diversification of packaging paths, such as those from Intel, a necessary direction, and related testing equipment and interface companies are also expected to benefit.